Packaging Engineer

Our client is a technology-oriented company developing advanced photonic integrated circuits and optical interconnect technologies for high-performance computing and communications applications. Its solutions address the growing demand for high-bandwidth, energy-efficient data transmission across artificial intelligence infrastructure, quantum computing systems, and space applications. The company operates at the intersection of integrated photonics, semiconductor engineering, and advanced packaging, translating innovative optical technologies into scalable products. Its activities combine photonic chip development, multidisciplinary engineering, optical and electronic integration, and advanced manufacturing processes. Operating within a dynamic, innovation-driven deep-tech environment, the organization is progressing from laboratory prototypes toward manufacturable, production-ready modules. This transition offers experienced engineers the opportunity to assume significant technical ownership, influence engineering decisions, and contribute directly to the industrialization of next-generation photonic technologies. Mission The Packaging Engineer will be responsible for leading the development, integration, and industrialization of advanced packaging solutions for photonic integrated circuits (PICs), transforming functional semiconductor dies into reliable, manufacturable optical modules. The position encompasses optical coupling and fiber attachment, high-speed electrical interconnections, and the integration of advanced substrate and interposer technologies. Working closely with multidisciplinary engineering teams and technical leadership, the successful candidate will drive packaging architecture decisions, establish repeatable assembly and characterization processes, and support the transition from prototype development toward pilot-production readiness. Responsibilities Photonic Packaging Architecture and Integration

• Lead the end-to-end packaging development of photonic integrated circuits, from initial package architecture through functional module integration.
• Develop and optimize optical interfaces, including fiber attachment, precision alignment, optical coupling, and bonding technologies.
• Define and integrate electrical interfaces covering DC and control connections, high-speed RF interconnects, and appropriate substrate or interposer technologies.

Packaging Process Development and Industrialization

• Develop and refine advanced packaging and assembly methods to transition from laboratory prototypes toward repeatable, pilot-production-ready processes.
• Evaluate packaging materials, assembly techniques, and integration approaches considering manufacturability, performance, reliability, and scalability.
• Identify critical process parameters, technical dependencies, and manufacturing constraints to improve assembly repeatability and production yield.

Optical Characterization and Cross-Functional Engineering

• Perform optical and electrical characterization of packaged photonic devices, using experimental measurements to validate functionality and identify performance limitations.
• Investigate packaging-related failures and performance deviations, applying structured debugging and engineering analysis to improve designs and assembly processes.
• Collaborate with photonic, electronic, and R&D engineering teams to integrate packaging requirements into component design, interface definition, and technical reviews.

Engineering Methods, Technical Coordination and Quality

• Establish and improve engineering, assembly, and characterization procedures suitable for a growing photonics development organization.
• Provide technical input on packaging trade-offs, integration risks, material selection, and design decisions to engineering teams and technical leadership.
• Support the definition of documentation, process controls, and verification practices to strengthen packaging consistency, reliability, and readiness for manufacturing scale-up.

Required Qualifications

• Master's degree or Ph.D. in Photonics, Optical Engineering, Electrical Engineering, Physics, or a closely related technical discipline.
• Minimum of 5 years of professional experience in photonics engineering, including substantial hands-on experience in advanced photonic integrated circuit packaging.
• Demonstrated technical expertise in optical coupling, fiber alignment and attachment, bonding methods, and photonic module integration.
• Working knowledge of high-speed RF interconnects, DC electrical interfaces, and advanced substrate or interposer technologies, including silicon, glass, ceramic, or organic materials.
• Practical experience with optical characterization methods, laboratory instrumentation, experimental measurements, and packaging performance analysis.
• Ability to evaluate technical trade-offs between optical, electrical, mechanical, and manufacturing requirements.
• Strong problem-solving, technical communication, and cross-functional collaboration skills, with the autonomy to lead complex engineering activities in a fast-paced development environment.

Preferred Experience

• Demonstrated ownership of at least one advanced photonic packaging technology from laboratory prototype development toward pilot-production implementation.
• Experience in photonic device design, optical modelling, or numerical simulation to support packaging architecture and integration decisions.
• Familiarity with reliability testing, qualification methodologies, and design-for-manufacturing principles for photonic or semiconductor modules.
• Experience collaborating with external semiconductor foundries, substrate manufacturers, advanced packaging providers, or specialized assembly partners.